Notification for PhD Admissions open for the Academic Session 2019-20

 

The Centre for Advanced Studies is an in-campus institution of Dr. A.P.J. Abdul Kalam Technical University Uttar Pradesh, Formerly Uttar Pradesh Technical University. The centre has state of the art infrastructure, cutting edge lab facilities with high quality faculty and is a research based institution focussed in specialized areas and multi-disciplinary research.

 

Online applications are invited for Admission to full time PhD Programmes in for the semester beginning July 2019.

 

1.      Computer Science and Engineering

2.      Mechatronics

3.      Nanotechnology

 

Online portal for registration will be opened on 15th June 2019 at 10:00 AM. Last date of application is 5:00 PM, 5th July 2019.

 

SCHOLARSHIP:

All the admitted students are eligible for a monthly stipend of Rs. 40,000 per month (under Deen Dayal Upadhyaya Quality Improvement Programme)*.

 

 

Registration Fee:

Registration fee for Gen/OBC applicants is Rs. 2000 and Rs. 1000 for SC/ST/Female/handicapped applicants. Selection of candidates will be based on written examination followed by interview of written qualified candidates. *.

 

*Note: Subject to other terms & conditions as per Ordinance and provisions in DDU Quality Improvement Program.

 

Eligibility Criterion

 

S. No.

Course

Eligibility

1.

PhD – Computer Science & Engineering

M.Tech. in Computer Science & Engineering / Information Technology/ Electronics and Communication Engineering with First Division or equivalent CGPA

2.

PhD - Mechatronics

M.Tech. in Mechatronics/ Mechanical Engineering/ Electronics & Communication Engineering/ Manufacturing Technology/ Manufacturing and Automation/ Automation and Robotics/ Electronics Engineering/ Electrical & Electronics Engineering/ Electronics & Instrument Engineering/ Electrical Engineering/ with First Division or equivalent CGPA

3.

PhD - Nano Science & Technology

*M.Tech. in Nanotechnology/ Aerospace Engineering/ Agriculture Engineering/ Biotechnology/ Computer Science and Information Technology/ Chemistry/ Electronics and Communication Engineering/ Electrical Engineering/ Instrumentation Engineering/ Metallurgical Engineering/ Petroleum Engineering/ Civil Engineering/ Physics/ Production and Industrial Engineering/ Textile Engineering and Fiber Science/ Polymer Science and Technology/ Food Technology/ Atmospheric Oceanic Science and Technology/ Environmental Engineering/ Chemical Engineering/ Material Science/ Mechanical Engineering with First Division or equivalent CGPA.
# M.Sc. in Physics, Chemistry, Biology and Mathematics with First Division or Equivalent CGPA with valid GATE score. Note: * Both B.Tech. – M.Tech. and B.Sc. – M.Sc. – M.Tech. combinations are eligible
# Pre-requisite course credit requirements will be different for M.Sc. qualified students

 

SYLLABUS for Ph.D Entrance Examination (2019-20)

Technical domain knowledge (80 questions)

Research methodology knowledge (20 questions)

 

 

1.    Computer Science & Engineering

Section1: Engineering Mathematics

Discrete Mathematics: Propositional and first order logic. Sets, relations, functions, partial orders and lattices. Groups. Graphs: connectivity, matching, coloring. Combinatorics: counting, recurrence relations, generating functions.

Linear Algebra: Matrices, determinants, system of linear equations, eigenvalues and eigenvectors, LU decomposition.

Calculus: Limits, continuity and differentiability. Maxima and minima. Mean value theorem. Integration.

Probability: Random variables. Uniform, normal, exponential, poisson and binomial distributions. Mean, median, mode and standard deviation. Conditional probability and Bayes theorem.

Computer Science and Information Technology

Section 2: Digital Logic

Boolean algebra. Combinational and sequential circuits. Minimization. Number representations and computer arithmetic (fixed and floating point).

Section 3: Computer Organization and Architecture

Machine instructions and addressing modes. ALU, data‐path and control unit. Instruction pipelining. Memory hierarchy: cache, main memory and secondary storage; I/O interface (interrupt and DMA mode).

Section 4: Programming and Data Structures

Programming in C. Recursion. Arrays, stacks, queues, linked lists, trees, binary search trees, binary heaps, graphs.

Section 5: Algorithms

Searching, sorting, hashing. Asymptotic worst case time and space complexity. Algorithm design techniques: greedy, dynamic programming and divide‐and‐conquer. Graph search, minimum spanning trees, shortest paths.

Section 6: Theory of Computation

Regular expressions and finite automata. Context-free grammars and push-down automata. Regular and contex-free languages, pumping lemma. Turing machines and undecidability.

Section 7: Compiler Design

Lexical analysis, parsing, syntax-directed translation. Runtime environments. Intermediate code generation.

Section 8: Operating System

Processes, threads, inter‐process communication, concurrency and synchronization. Deadlock. CPU scheduling. Memory management and virtual memory. File systems.

Section 9: Databases

ER‐model. Relational model: relational algebra, tuple calculus, SQL. Integrity constraints, normal forms. File organization, indexing (e.g., B and B+ trees). Transactions and concurrency control.

Section 10: Computer Networks

Concept of layering. LAN technologies (Ethernet). Flow and error control techniques, switching. IPv4/IPv6, routers and routing algorithms (distance vector, link state). TCP/UDP and sockets, congestion control. Application layer protocols (DNS, SMTP, POP, FTP, HTTP). Basics of Wi-Fi.

Network security: authentication, basics of public key and private key cryptography, digital signatures and certificates, firewalls.

 

 

2.      NANOTECHNOLOGY

 

General aptitude in RM (Research Methodology) and fundamentals/basics: in/of Nano Science and Nanotechnology as well as in/of the following topics.

 

Quantum Physics: Basis of Quantum Physics, de Broglie’s concept, operators, physical imperfection of wave function, normalised and orthogonal wave function, Heisenberg’s uncertainty Principle.

 

Solid State Physics: Crystal structure, Bravais lattices and its basics, Miller indices, X-ray diffraction and Bragg’s law, free electron theory of metals. Fermi energy and density of states, origin of energy bands, concept of holes and effective mass. Energy levels in One Dimension, Fermi-Dirac distribution, effect of Temperature on the Fermi-Dirac Distribution, free electron gas in three-dimension, crystal imperfections: Point imperfections – vacancy, substitution and interstitial impurity.

 

Applied Chemistry: Structure of solids, symmetry concepts, crystal structure. Preparative methods and characterization of inorganic solids. Crystal defects and non-stoichiometry. Interpretation of phase diagrams, phase transitions. Kinetics of phase transformations, structure property correlations in ceramics, glasses, polymers. Composites and nanomaterials. Basic concepts in biomaterials science, concept and assessment of biocompatibility of biomaterials, examples of some important metallic biomaterials, bio- ceramics and bio- composites

 

Electricity and Magnetism: Coulomb’s law, Gauss’s law. Electric field and potential. Electrostatic boundary conditions, conductors, capacitors, dielectrics, dielectric polarization, volume and surface charges, electrostatic energy. Biot-Savart law, Ampere’s law, Faraday’s law of electromagnetic induction Maxwell’s equations and static and time varying equations, Poynting’s theorem, Lorentz Force and motion of charged particles in electric and magnetic fields, Clausius–Mossotti relation. Fundamentals about dia-, para- and ferromagnetism, Langevin’s theory of Para magnetism, Curie’s law.

 

Materials and their properties: Different types of materials: Metals, Semiconductors, Composite materials, Ceramics, Alloys, Polymers. Chemical Bonding-Atomic Bonding in solids, Types of bond: Metallic, Ionic, Covalent and van der Waals bond; Hybridisation; Molecular orbital theory;

Electrochemistry fundamentals

o   Mechanical Properties: Stress-strain response of metallic, ceramic and polymer materials, yield strength, tensile strength and modulus of elasticity, toughness, plastic deformation, fatigue, creep and fracture,

o    Electronic Properties: Free electron theory, Fermi energy, density of states, elements of band theory, semiconductors, Hall effect, dielectric behaviour, piezo, ferro, pyroelectric materials,

o  Magnetic Properties: Origin of magnetism in metallic and ceramic materials, paramagnetism, diamagnetism, ferro and ferrimagnetism,

o  Thermal Properties: Specific heat, thermal conductivity and thermal expansion, thermoelectricity,

o   Optical Properties: Refractive index, absorption and transmission of electromagnetic radiation in solids, electrooptic and magneto-optic materials, spontaneous and stimulated emission, gas and solid-state lasers

 

Fabrication: Nanoparticles Synthesis-Carbon Nanotubes, Metal nanoparticles, Q-Dots, Nanowires Thin film synthesis-Chemical Vapor Deposition, Physical Vapor Deposition, Self-Assembly, Lithography- Optical & Electron Lithography, Resists.

 

Characterisation: Electron microscopes, scanning electron microscopes, transmission electron microscope, scanning probe microscopy, atomic force microscopy, scanning tunnelling microscope, Spectroscopy- FTIR, UV-Vis, Raman.

Electronics: Intrinsic and extrinsic Semiconductors. Fermi level. p-n junctions, transistors, semiconductor; diodes; solar cell fundamentals

 

 

3.      MECHATRONICS

 

Engineering Mechanics:
Free-body diagrams and equilibrium; trusses and frames; kinematics and dynamics of particles and of rigid bodies in plane motion; impulse and momentum (linear and angular), collisions.
Machine Design:
Design for static and dynamic loading; failure theories; fatigue strength and the principles of the design of machine elements such as bolted, riveted and welded joints; shafts, gears, rolling and sliding contact bearings, brakes and clutches, springs, Cams, gears and gear trains Heat-Transfer: Modes of heat transfer; one dimensional heat conduction, resistance concept and electrical analogy, heat transfer through fins; heat transfer correlations for flow over flat plates and through pipes.
Engineering Materials:
Structure and properties of engineering materials, phase diagrams, heat treatment, stress-strain diagrams for engineering materials. Joining Processes: Principles of welding, brazing, soldering and adhesive bonding. Metrology and Inspection: Limits, fits and tolerances; linear and angular measurements; comparators.
Basic Electronics:
Conductors, insulators, semi-conductors, Passive components used in Electronics, Transformers, semi-conductors, Transistors, Silicon controlled rectifiers (SCR), Integrated Circuits (IC), Digital Circuits. Diodes, Electrical Elements, Energy bands in intrinsic and extrinsic, mobility and resistivity; P-N junction, Zener diode, BJT, MOS capacitor, MOSFET, LED, photo diode and solar cell.
Electrical and Mechanical Actuators:
Drives, Spindle drives, feed drives, AC and DC motors, Stepper motors, Servo motors, Servoprinciple, Drive protection, Pascal Law, Pneumatic and hydraulic actuators etc. Sensors and Transducers: Potentiometer, Variable-Inductance Transducer, Variable-Capacitance Transducers, Piezoelectric Sensors, Strain Gauges, Torque sensors, Tactile sensing, Ultra sonic sensors, Thermo fluid sensors, Digital transducers.
Digital Hardware and Microcontrollers:
Number systems and codes, Microcontrollers: Architecture, microprocessor, memory,
Control Systems
Basic control system components; Feedback principle; Transfer function; Block diagram representation, stability, Fuzzy logic control, digital control.

 

 

 

Admission Incharge

Centre for Advanced Studies

Dr. APJ Abdul Kalam Technical University Uttar Pradesh